Veranstaltungen

It reminded us again that aerospace assets travel overland, through the air, in the sea, and finally up into space.

As a Premier Sponsor of the ISTA Forum, please join us for this informative event. A chance for us to say hello and share exciting news associated with Lansmont Field-to-Lab technologies.

A proven combination of Lansmont technology and methodology - capturing real field shock and vibration data and replicating it in controlled laboratory environments.

Lansmont, along with NVT Group members Team and Data Physics, will participate in the first Automotive Testing Show and Expo, which will take place December 8th and 9th at the Millbrook Proving Grounds, located in Bedford, United Kingdom.

NVT Group members, Data Physics, Lansmont and Team will participate in the Automotive Testing Expo China

Lansmont and the NVT Group will be participating and exhibiting at the 2015 Battery Show, held in Novi, Michigan, Tuesday September 15-17.  

ISTA European Packaging Symposium - Exploring the Future of Responsible Transport Packaging

David Jin and Eric Joneson of Lansmont recently delivered market-based application presentations in China during the first two weeks of October. 

Lansmont recently participated in GlobalPack 2012, hosted by the Central Philippine University in Iloilo City.

This year's ISTA China Packaging Symposium will be held in Suzhou City on September 18-20. Lansmont, the Platinum sponsor for this event, will be well represented during this informative international program.

Fraunhofer provided a tour of their state-of-the-art facilities, highlighting their most recent addition, the Lansmont Load Stability Horizontal Impact Test System (HITS).

Thursday, June 13, Lansmont cooperated with the Belgian Packaging Institute (BPI), located in Brussels, to host a one-day seminar, titled "Behavior of Packages During Transport; Field-to-Lab® Simulations Test Procedures & Standards".

Lansmont Equipment and Instruments replicate and measure dynamic environments for numerous applications.

The VTT Technical Research Centre of Finland hosted the 26th International Association of Packaging Research Institute's (IAPRI) Symposium on Packaging this past June 10-13 2013 on its Otaniemi campus, located in Helsinki.

Lansmont and Adams Technologies, our representative in India, are holding three educational seminars in India this week.

The week of July 23rd, Central Philippine University (CPU) will host GlobalPack 2012, in Iloilo City.

Lansmont Shock Systems have many applications - but perhaps the main function - is to assess the fragility and / or survivability of products and components.

ASTM Committee D10 on Packaging oversees many of the ASTM specifications utilized for packaging material testing and performance testing.

Lansmont and SGS delivered a Package Testing Seminar at SGS's Shanghai offices.

Lansmont just completed an active and productive week of activity in Orlando at the ISTA Transport Forum.

Lansmont is a platinum sponsor of the ISTA Transport Packaging Forum (April 2–5).

On April 12, Lansmont and SGS will be offering a Package Testing Seminar in Shanghai.

Lansmont will be showcasing our products and services at the upcoming MD&M West show in Anaheim, CA.